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Title:
SUBSTRATE PROCESSING DEVICE, METHOD FOR MEASURING LIFT PIN HEIGHT DEVIATION, AND RECORDING MEDIUM ON WHICH COMPUTER-READABLE PROCESSING PROGRAM IS RECORDED
Document Type and Number:
Japanese Patent JP2021197553
Kind Code:
A
Abstract:
To provide a substrate processing device capable of confirming the presence or absence of a lift pin height deviation, a method for measuring the lift pin height deviation, and a recording medium on which a computer-readable processing program is recorded.SOLUTION: A method for measuring lift pin height deviation in wafer processing equipment includes steps of: receiving a first center position which is the center position of a wafer W with respect to a reference position measured before the wafer W is loaded to a support unit 220 including a plurality of lift pins 320 provided in a process chamber 26 by a transfer robot 21a; receiving a second center position which is the center position of a board with respect to the measured reference position after picking up the board unloaded using the support unit by the transfer robot; and deriving the presence or absence of a difference between the top height of one or more of the lift pins and the height of one or more other top heights of the lift pins from among the vector difference between the first center position and the second center position.SELECTED DRAWING: Figure 2

Inventors:
KWON MING SUNG
LEE YOONGHEE
Application Number:
JP2021097859A
Publication Date:
December 27, 2021
Filing Date:
June 11, 2021
Export Citation:
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Assignee:
SEMES CO LTD
International Classes:
H01L21/677
Domestic Patent References:
JP2018206992A2018-12-27
JP2003203965A2003-07-18
JP2012182393A2012-09-20
JPS6448443A1989-02-22
JP2017139251A2017-08-10
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kaoru Takahashi