Title:
アルミベース基板の回収方法
Document Type and Number:
Japanese Patent JP5710941
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for separately recovering an aluminum base substrate part from a printed wiring board including an aluminum base substrate.SOLUTION: In a method for recovering an aluminum base substrate, a printed wiring board 1 including an electronic circuit 4 formed on an aluminum base substrate 2 via an insulation layer 3 made of one of an epoxy resin, a phenol resin, a polyimide resin and the like is heated at a thermal decomposition starting temperature of a resin of the insulation layer 3 or more and less than a melting temperature of aluminum, for example, heated at a temperature of 200°C or more and less than 660°C for 1 second or longer. When the printed wiring board 1 is heated in this way, the aluminum base substrate 2 is easily separated from the insulation layer 3, so that the aluminum base substrate 2 can be efficiently recovered.
Inventors:
Ryoichi Shirai
Kuniyoshi Hori
Hosaka Hideto
Honor Kenji
Kuniyoshi Hori
Hosaka Hideto
Honor Kenji
Application Number:
JP2010253614A
Publication Date:
April 30, 2015
Filing Date:
November 12, 2010
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C22B21/00; C22B1/00; C22B7/00; H05K3/44
Domestic Patent References:
| JP10099815A | ||||
| JP9170034A | ||||
| JP2000210650A | ||||
| JP2009535204A |
Foreign References:
| WO2010055489A1 |
Attorney, Agent or Firm:
Takeuchi/Ichizawa International Patent Office