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Title:
A recovery method and a recovery subsystem
Document Type and Number:
Japanese Patent JP6214413
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a recovery method which enables recovery work of a noble metal from a used electronic substrate and the like to be performed at low cost and with high efficiency, and to provide a recovery apparatus for use in recovery work using the recovery method.SOLUTION: There is provided the recovery method comprising the steps of: electrolyzing a neutral salt solution to produce an acidic solution and an alkaline solution; charging a substrate containing a gold-containing member into a first treatment solution which is one of the acidic solution and the alkaline solution, and installing an anode and a cathode in the first treatment solution; peeling the gold-containing member from the substrate by applying a voltage between the anode and the cathode while the anode and the gold-containing member are in contact with each other; recovering the gold-containing member peeled from the substrate, from the first treatment solution; precipitating impurity materials other than gold into a third treatment solution produced by adding a second treatment solution which is another of the acidic solution and the alkaline solution, to the first treatment solution; and recovering impurity materials from the third treatment solution.

Inventors:
Hisai Katsura
Takahashi Riko
Application Number:
JP2014017159A
Publication Date:
October 18, 2017
Filing Date:
January 31, 2014
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
C22B11/00; B09B5/00; C02F1/46; C22B7/00
Domestic Patent References:
JP47013283B1
JP46000922B1
JP2013528696A
Attorney, Agent or Firm:
Fukami patent office