Title:
A regeneration method, the plating method, and a plating device of plating liquid
Document Type and Number:
Japanese Patent JP6033234
Kind Code:
B2
Abstract:
A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.
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Inventors:
Tatsuya Sakano
Katsuhiro Goto
Toruhiro Kanazawa
Katsuhiro Goto
Toruhiro Kanazawa
Application Number:
JP2013547171A
Publication Date:
November 30, 2016
Filing Date:
November 27, 2012
Export Citation:
Assignee:
Fuji Trading Co., Ltd.
International Classes:
C23C18/16; C23C18/31; C23C18/38; C25D21/14; C25D21/18
Domestic Patent References:
| JP6256999A |
Attorney, Agent or Firm:
Kobayashi Osamu
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