Title:
Release agent removal method and tires
Document Type and Number:
Japanese Patent JP6364228
Kind Code:
B2
Abstract:
A method for efficiently and completely removing a mold release agent adhering to a tire surface after a cure-molding process. In this method, the mold release agent is removed from an adherend region where an adherend is to be affixed to the tire surface after cure-molding. A laser light having an intensity capable of removing rubber on the tire surface in the adherend region is intermittently irradiated while it is moved along. Thus a plurality of dents are formed in the adherend region in such a manner that the adjoining dents have their edges overlapped with each other.
Inventors:
Toshiki Nakamura
Application Number:
JP2014097722A
Publication Date:
July 25, 2018
Filing Date:
May 09, 2014
Export Citation:
Assignee:
Bridgestone Corporation
International Classes:
B29D30/06; B60C13/00
Domestic Patent References:
| JP2013540065A | ||||
| JP2012520780A | ||||
| JP2013223932A | ||||
| JP2013223930A | ||||
| JP2008037086A | ||||
| JP2007283749A | ||||
| JP2012206521A | ||||
| JP2014004823A | ||||
| JP3166790A |
Attorney, Agent or Firm:
Junichi Miyazono
Miyazono Yasuo
Miyazono Yasuo