REPAIR MATERIAL SET AND REPAIR METHOD FOR HUMIDITY-CONDITIONING SUBSTRATE

Japanese Patent JP2016211168

A

PROBLEM TO BE SOLVED: To provide a repair material set and a repair method for the same for repairing a damage measuring a prescribed depth or more formed on the humidity-conditioning substrate to a flat and inconspicuous condition.SOLUTION: A repair material set for a humidity-conditioning substrate includes a putty material containing a filler, a first water dispersible resin and water, and a repair liquid containing a color material, a second water dispersible resin and water. A repair method for the humidity-conditioning substrate includes the following steps for: introducing the putty material containing the filler, the first water dispersible resin and water into a damaged part of the humidity-conditioning substrate and smoothing the putty material so that the damaged part into which the putty material has been introduced is flush with a surface of the humidity-conditioning substrate; drying the smoothed putty material on the damaged part of the humidity-conditioning substrate; and applying the repair liquid containing the color material, the second water dispersible resin and water on the putty material that has been introduced into the damaged part and smoothed.SELECTED DRAWING: None

TABUCHI SHINJI
YAMAMOTO HIROMINE
TERAKADO YASUMI

JP2015093230A

December 15, 2016

April 30, 2015

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RISO KAGAKU CORP

E04G23/02

JP2001187861A	2001-07-10
JP2000313840A	2000-11-14
JPH09209576A	1997-08-12
JP2004010378A	2004-01-15

Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito

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