Title:
A resin composition, B stage sheet, metallic foil with resin, a metal substrate, and an LED board
Document Type and Number:
Japanese Patent JP6024813
Kind Code:
B2
Inventors:
Amanuma Shinji
Yuji Kobayashi
Hiroyuki Tanaka
Naoki Hara
Kensuke Yoshihara
Yuji Kobayashi
Hiroyuki Tanaka
Naoki Hara
Kensuke Yoshihara
Application Number:
JP2015213115A
Publication Date:
November 16, 2016
Filing Date:
October 29, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/62; B32B15/092; B32B15/098; B32B27/20; C08G59/24; C08K3/22; C08L61/12; C08L63/00; H01L33/00; H05K1/03; H05K1/05
Domestic Patent References:
| JP2007262398A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office