Title:
MODIFIED POLYPHENYLENE ETHER RESIN-BASED HIGH MOLECULAR COPOLYMER COMPOUND, TERMINAL-MODIFIED POLYMER COMPOUND OBTAINED BY USING SAID HIGH MOLECULAR COPOLYMER COMPOUND, AND RESIN COMPOSITION CONTAINING THESE COMPOUNDS
Document Type and Number:
Japanese Patent JP2019182989
Kind Code:
A
Abstract:
To provide a high molecular copolymer compound and a terminal-modified polymer compound using the copolymer compound, that have high heat resistance and adhesion while having excellent film-forming capability, and that have a low dielectric constant and low dielectric loss tangent.SOLUTION: Provided is a high molecular copolymer compound, which is a high molecular compound that is a random copolymer of (A) a polyphenylene ether resin having a phenolic hydroxyl group at both ends and (B) an aliphatic polymer having a carboxy group at both ends, and (C) a binder, and in which the mole number a of said (A) polyphenylene ether resin, the mole number b of said (B) aliphatic polymer, and the mole number c of said binder (C) satisfy the relationship of (a+b)>c.SELECTED DRAWING: None
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Inventors:
AKATSUKA YASUMASA
TANAKA RYUTARO
NAGASHIMA NORIYUKI
SHIRAI KAZUMITSU
TANAKA RYUTARO
NAGASHIMA NORIYUKI
SHIRAI KAZUMITSU
Application Number:
JP2018075133A
Publication Date:
October 24, 2019
Filing Date:
April 10, 2018
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G81/00; C08F299/06; C08G18/48; C09J7/10; C09J7/30; C09J175/08; C09J175/16