Title:
樹脂組成物及びその硬化物ならびにそれを用いた光半導体用反射材
Document Type and Number:
Japanese Patent JP5841237
Kind Code:
B2
Abstract:
A resin composition which contains (A) a copolymer that contains a specific (meth)acrylate unit and a specific glycidyl (meth)acrylate unit, (B) a curing agent, (C) a curing accelerator and (D) a white pigment; a cured product of the resin composition; and a reflective material for optical semiconductors, which uses the cured product.
Inventors:
Yasuya Okada
Application Number:
JP2014507583A
Publication Date:
January 13, 2016
Filing Date:
February 28, 2013
Export Citation:
Assignee:
Osaka Organic Chemical Industry Co., Ltd.
International Classes:
H01L33/60; C08F220/32; C08G59/32; C08G59/42; C08K3/22; C08L63/00; G02B5/08
Domestic Patent References:
| JP2003321643A | ||||
| JP40021342B1 | ||||
| JP2001059904A |
Foreign References:
| WO2011115159A1 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office