Title:
The resin composition for electronic devide closure, and an electronic devide
Document Type and Number:
Japanese Patent JP5981577
Kind Code:
B2
Abstract:
An electronic-device-sealing resin composition and an organic EL element that include, as a cross-linking metal-organic drying agent, a metal-complex compound that has, as a ligand, a cross-linking alkoxide that is represented by general formula (1). General formula (1): M(ORx)n. In general formula (1), M represents Al, B, Ti, or Zr, the Rx of the ligand represents an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by general formula (a), at least one Rx is a cross-linking group, and n represents the valence of M. In general formula (a), O* represents the O of the ORx in general formula (1), R1 represents an alkyl group, an alkenyl group, or an acyl group, R2 represents a hydrogen atom or an alkyl group, and R3 represents an alkyl group or an alkoxy group.
Inventors:
Tetsuya Saegusa
Takumi Asanuma
Ishizaka Yasushi
Keiji Saito
Takumi Asanuma
Ishizaka Yasushi
Keiji Saito
Application Number:
JP2015017222A
Publication Date:
August 31, 2016
Filing Date:
January 30, 2015
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H05B33/04; B01D53/28; B01J20/22; C09K3/10; H01L23/29; H01L23/31; H01L51/50
Domestic Patent References:
| JP2006003432A | ||||
| JP2014140797A | ||||
| JP2011026521A | ||||
| JP2012038660A | ||||
| JP2007191511A | ||||
| JP2005007235A | ||||
| JP2013082815A | ||||
| JP59042540A | ||||
| JP2005298598A | ||||
| JP2015086376A | ||||
| JP2012036240A |
Foreign References:
| WO2011027658A1 | ||||
| WO2012086334A1 | ||||
| WO2012063626A1 | ||||
| WO2011001823A1 | ||||
| GB1473335A |
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae