Title:
The resin composition for flexible printed wiring boards
Document Type and Number:
Japanese Patent JP5914169
Kind Code:
B2
Abstract:
A resin composition for a flexible printed circuit board that can attain high adhesiveness and solder reflow resistance even if a base film having low dielectric properties is used, and that attains excellent electrical properties. The resin comprises a fluororesin and an isocyanate compound, wherein the fluororesin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g/equivalent.
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Inventors:
Akira Uchiyama
Kazuo Yoshikawa
Makoto Tai
Nobuyuki Iwano
Kazuo Yoshikawa
Makoto Tai
Nobuyuki Iwano
Application Number:
JP2012121259A
Publication Date:
May 11, 2016
Filing Date:
May 28, 2012
Export Citation:
Assignee:
Arisawa Manufacturing Co., Ltd.
International Classes:
C08L27/12; B32B15/082; C08K3/22; C08K5/29; C08K5/3477; C08K5/49; C08L63/00; C08L75/00; C09J7/02; C09J11/04; C09J11/06; C09J11/08; C09J127/12; C09J163/00; C09J175/00; H05K1/03
Domestic Patent References:
| JP2009277764A | ||||
| JP2008012418A |
Foreign References:
| WO2012057124A1 |
Other References:
FEVE,2006年,p.72,77
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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