Title:
A resin composition, the glue film by it, and a cover lei film
Document Type and Number:
Japanese Patent JP5955156
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the frequency range of 1-10 GHz, while having a flame retardancy meeting V-0 or VTM-0 according to UL-94 standard; and a resin composition which is used for the purpose of producing the adhesive film and the coverlay film. The present invention provides a resin composition which is characterized by containing (A) a vinyl compound represented by general formula (1) and having a mass average molecular weight (Mw) of 500-4,000, (B) a thermoplastic elastomer, (C) a thermosetting resin other than the vinyl compound represented by general formula (1), (D) a curing agent and (E) an organic aluminum phosphinate. This resin composition is also characterized in that the component (E) is contained in an amount of 10-50 parts by mass per 100 parts by mass of the total of the component (A), the component (B), the component (C), the component (D) and the component (E).
Inventors:
Satoko Takahashi
Shin Teraki
Masaki Yoshida
Shin Teraki
Masaki Yoshida
Application Number:
JP2012177857A
Publication Date:
July 20, 2016
Filing Date:
August 10, 2012
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08L63/10; C08K5/5313; C08L53/02; C08L71/00; C09J7/10; C09J179/08
Domestic Patent References:
| JP201168713A |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa