Title:
RESIN COMPOSITION, LAMINATE AND CONSTRUCTION MATERIAL
Document Type and Number:
Japanese Patent JP2016204498
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition good in adhesiveness between a soft polyvinyl chloride resin layer and a polyolefin resin layer or an ethylene vinyl acetate copolymer saponified layer, capable of melting molding or thermal adhesion without using an organic solvent-based adhesive and having no reduction of adhesiveness with the resin layer even when conducting a heating treatment and suitable as a resin for adhesive layer.SOLUTION: There is provided a resin composition containing following component (A) and component (B) with the content of the component (A) of 15 to 90 wt.% based on the total amount thereof. Component (A):an ethylene vinyl acetate copolymer. (B) component: a modified ethylene vinyl acetate copolymer obtained by impregnation polymerization of the ethylene vinyl acetate copolymer by a styrenic monomer.SELECTED DRAWING: None
Inventors:
WATANABE NAOYA
Application Number:
JP2015086839A
Publication Date:
December 08, 2016
Filing Date:
April 21, 2015
Export Citation:
Assignee:
MCPP INNOVATION LLC
International Classes:
C08L23/08; B32B27/28; B32B27/30; B32B27/32; C08K5/20; C08L23/14; C08L51/00
Domestic Patent References:
| JP2001302856A | 2001-10-31 | |||
| JPH0439811A | 1992-02-10 | |||
| JPS56127613A | 1981-10-06 | |||
| JPS61137738A | 1986-06-25 | |||
| JP2013023573A | 2013-02-04 |
Other References:
「便覧」編集室編, 便覧 ゴム・プラスチック配合薬品 新訂版, JPN6019002308, 2001, pages 289 - 299, ISSN: 0004084210
Attorney, Agent or Firm:
Tsuyoshi Shigeno
Takayuki Shigeno
Takayuki Shigeno