RESIN COMPOSITION, RESIN MOLDING AND INSULATED WIRE

Title:

RESIN COMPOSITION, RESIN MOLDING AND INSULATED WIRE

Document Type and Number:

Japanese Patent JP2018009133

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a resin composition that makes it possible to obtain a resin molding having excellent heat resistance and flexibility.SOLUTION: A resin composition according to one embodiment contains a polymer having a 4-methyl pentene-1 unit and a plasticizer, where the plasticizer is liquid at 25°C, and has a relative dielectric constant at 25°C of 2.10 or more and 2.40 or less, and a content of the plasticizer is 5 pts.mass or more and 40 pts.mass or less relative to the polymer 100 pts.mass.SELECTED DRAWING: Figure 1

Inventors:

YAMAZAKI SATOSHI
NISHIKAWA SHINYA

Application Number:

JP2016140777A

Publication Date:

January 18, 2018

Filing Date:

July 15, 2016

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES

International Classes:

C08L23/20

Attorney, Agent or Firm:

Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka

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