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Title:
RESIN COMPOSITION AND RESIN MOLDED MATERIAL
Document Type and Number:
Japanese Patent JP2018053089
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition from which a resin molded material excellent in flexural modulus can be produced.SOLUTION: Provided is a resin molded material comprising: a thermoplastic resin; a carbon fiber; a polyamide having a structural unit in which a dicarboxylic acid and a diamine are condensation-polymerized, or a structural unit in which a lactam is ring-opened and comprising an aromatic ring except for an aramid structural unit, and a structural unit not comprising an aromatic ring; and a compatibilizing agent, and in which a part of the polyamide forms a domain having a diameter of 0.1 μm or more and 10 μm or less in the thermoplastic resin.SELECTED DRAWING: None

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Inventors:
OGOSHI MASAYUKI
MORIYA HIROYUKI
MIYAMOTO TAKESHI
Application Number:
JP2016190269A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
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Assignee:
FUJI XEROX CO LTD
International Classes:
C08L101/00; C08K7/06; C08L77/00
Domestic Patent References:
JP2010168526A2010-08-05
JPS62236851A1987-10-16
JPH0258552A1990-02-27
JP2003528956A2003-09-30
JP2014043549A2014-03-13
Foreign References:
WO2013094763A12013-06-27
WO2016076411A12016-05-19
WO2016132829A12016-08-25
WO2015166896A12015-11-05
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office



 
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