新規リン原子含有フェノール樹脂、その製造方法、硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物

Title:

Document Type and Number:

Japanese Patent JP5516980

Kind Code:

B2

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Inventors:

Koji Hayashi

Application Number:

JP2010196657A

Publication Date:

June 11, 2014

Filing Date:

September 02, 2010

Export Citation:

Assignee:

DIC Corporation

International Classes:

C08G14/12; C08G59/62; C08L63/00; H01L23/29; H01L23/31; H05K1/03

Domestic Patent References:

Foreign References:

WO2010106698A1

Attorney, Agent or Firm:

Kono Tsuyo

Previous Patent: JPS5516979

Next Patent: JPS5516981