Title:
RESIN COMPOSITION FOR PLATING AND PLATING MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2018002989
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for plating and a plating molded article which are excellent in impact resistance and flowability, and have an excellent balance among a plating adhesion strength, plating precipitation and cooling/heating cycle.SOLUTION: A resin composition contains a polycarbonate resin (A), a graft copolymer (B) and a copolymer (C), and satisfies the following conditions (1) to (5): (1) content of the polycarbonate resin (A) of 20-60 mass% with respect to 100 mass% of total of (A), (B) and (C); (2) graft copolymer (B) formed by graft polymerization of rubbery polymer and monomer component containing aromatic vinyl monomer; (3) copolymer (C) formed by polymerization of monomer component containing aromatic vinyl monomer and vinyl cyanide monomer; (4) content of rubbery polymer of 7-20 mass% with respect to resin composition; and (5) content of oligomer component of less than 1 mass% with respect to resin composition.SELECTED DRAWING: None
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Inventors:
FUJIWARA TAKAYOSHI
MATSUMOTO NANA
MATSUMOTO NANA
Application Number:
JP2016136315A
Publication Date:
January 11, 2018
Filing Date:
July 08, 2016
Export Citation:
Assignee:
NIPPON A&L INC
International Classes:
C08L69/00; C08F253/00; C08L25/12; C08L51/04; C25D5/56
Domestic Patent References:
JP2007197695A | 2007-08-09 | |||
JP2014074159A | 2014-04-24 | |||
JP2002528589A | 2002-09-03 | |||
JPH10279789A | 1998-10-20 | |||
JP2003327817A | 2003-11-19 |
Foreign References:
CN102719076A | 2012-10-10 | |||
WO2015108075A1 | 2015-07-23 |