Title:
A resin composition, pre-preg, a laminate sheet, and a printed wired board
Document Type and Number:
Japanese Patent JP6115225
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve such problems that:(1) a volume ratio of a resin composition is decreased to decrease the fluidity of the composition, which thereby degrades viscosity of a prepreg obtained by impregnating a base material such as glass cloth with the resin composition and half-curing the material; (2) a metal foil-clad laminate obtained by laminating and curing the above prepreg with a metal foil has low moldability such as inducing cracks or voids; and (3) the metal foil-clad laminate shows degradation in moisture absorption heat resistance, an elastic modulus, and adhesive strength between a copper foil and an insulating layer of the laminate.SOLUTION: A resin composition is provided, comprising an epoxy resin (A) expressed by formula (1), a phenol resin (B), a maleimide compound (C) and an inorganic filler (D), in which the content of the inorganic filler (D) in the resin composition is 50 to 600 pts.mass with respect to total 100 pts.mass of the components (A) to (C).
Inventors:
Chiba friend
Tomizawa Katsuya
Hiroshi Takahashi
Eisuke Shiga
Tomizawa Katsuya
Hiroshi Takahashi
Eisuke Shiga
Application Number:
JP2013060290A
Publication Date:
April 19, 2017
Filing Date:
March 22, 2013
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
B32B5/28; C08J5/24; B32B15/08; B32B27/20; C08G59/62; C08K3/00; C08K5/3415; C08L35/00; C08L61/04; C08L63/00; H05K1/03
Domestic Patent References:
| JP2006299246A | ||||
| JP7053672A | ||||
| JP2004307673A | ||||
| JP2014148653A |
Foreign References:
| WO2011126070A1 |
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