Title:
Resin composition, prepreg, laminated board, metal foil-clad laminated board, and printed wiring board
Document Type and Number:
Japanese Patent JP6332036
Kind Code:
B2
Abstract:
An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).
Inventors:
Chiba friend
Hiroshi Takahashi
Eisuke Shiga
Sadahiro Kato
Hiroshi Takahashi
Eisuke Shiga
Sadahiro Kato
Application Number:
JP2014550206A
Publication Date:
May 30, 2018
Filing Date:
November 27, 2013
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L63/00; B32B17/04; C08J5/24; C08K3/00; C08K5/315; C08K5/3415; C08L55/00; C08L61/04; H05K1/03
Domestic Patent References:
| JP2011195673A | ||||
| JP2010044998A | ||||
| JP2006193619A | ||||
| JP2002088224A | ||||
| JP7206949A | ||||
| JP63228649A | ||||
| JP2228319A | ||||
| JP3106960A | ||||
| JP2006193607A | ||||
| JP2010100803A | ||||
| JP2003502484A | ||||
| JP2003531941A | ||||
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Foreign References:
| WO2011005925A1 | ||||
| WO2011132674A1 | ||||
| WO2012121224A1 | ||||
| WO2012099162A1 | ||||
| WO2012029690A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito
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