Title:
A resin composition, the pre-preg using this, a laminate sheet, a printed wired board
Document Type and Number:
Japanese Patent JP6241536
Kind Code:
B2
Abstract:
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.
Inventors:
Masato Miyatake
Tomohiko Kotake
Nagai Shunsuke
Hashimoto Shintaro
Inoue Yasuo
Shin Takanezawa
Murai Yo
Tomohiko Kotake
Nagai Shunsuke
Hashimoto Shintaro
Inoue Yasuo
Shin Takanezawa
Murai Yo
Application Number:
JP2016246740A
Publication Date:
December 06, 2017
Filing Date:
December 20, 2016
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08J5/24; C08L83/04; C08K3/00; C08K5/18; C08K5/3415; C08K5/3445; C08L101/00; H05K1/03
Domestic Patent References:
| JP2008095014A | ||||
| JP5831462B2 | ||||
| JP6122765A | ||||
| JP2010248495A | ||||
| JP2010248473A | ||||
| JP2010106151A |
Foreign References:
| WO2010110433A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama
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