Title:
プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板、及びプリント配線板
Document Type and Number:
Japanese Patent JP6481610
Kind Code:
B2
Abstract:
A resin composition used as a material of an insulating layer of a printed wiring board comprising the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition comprising: an epoxy compound (A); a cyanate compound (B); a maleimide compound (C); an inorganic filler (D); and an imidazole silane (E), wherein the maleimide compound (C) comprises a predetermined maleimide compound, a content of the maleimide compound (C) is 25% by mass or less based on 100% by mass of a total content of the epoxy compound (A), the cyanate compound (B), and the maleimide compound (C), and the imidazole silane (E) comprises a compound represented by the following formula (3).
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Inventors:
Keiichi Hasebe
Naoki Kashima
Takeki Takiguchi
Takaaki Ogashi
Naoki Kashima
Takeki Takiguchi
Takaaki Ogashi
Application Number:
JP2015521439A
Publication Date:
March 13, 2019
Filing Date:
June 02, 2014
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/40; C08J5/24; C08K3/013; C08K5/544; H05K1/03; H05K3/46
Domestic Patent References:
| JP2003318499A | ||||
| JP2001348393A |
Foreign References:
| WO2012165423A1 | ||||
| WO2013008684A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito
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