Title:
樹脂組成物及び該樹脂組成物を使用して作製した半導体装置
Document Type and Number:
Japanese Patent JP4967655
Kind Code:
B2
Abstract:
A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Inventors:
Mitsuru Okubo
Nobuki Tanaka
Watanabe
Nobuki Tanaka
Watanabe
Application Number:
JP2006511210A
Publication Date:
July 04, 2012
Filing Date:
March 16, 2005
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J135/00; C08F290/06; C08G69/40; C08G69/46; C09J4/02; C09J109/00; C09J167/00; C09J169/00; C09J171/00; C09J201/02; H01L21/52; H01L21/58; H01L23/36; H01L23/373
Domestic Patent References:
| JP10505599A | ||||
| JP11124403A | ||||
| JP2003327925A | ||||
| JP10168413A | ||||
| JP2006241368A |
Attorney, Agent or Firm:
Kishimoto Tatsuto
Akihiko Yamashita
Tetsuro Hoshino
Akihiko Yamashita
Tetsuro Hoshino