Title:
樹脂組成物およびそれを用いた半導体装置
Document Type and Number:
Japanese Patent JP5556051
Kind Code:
B2
Inventors:
Takeuchi Gotsu
Junya Kusunoki
Hiromichi Sugiyama
Junya Kusunoki
Hiromichi Sugiyama
Application Number:
JP2009099203A
Publication Date:
July 23, 2014
Filing Date:
April 15, 2009
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L45/00; B81C1/00; C08F232/08; C08L69/00