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Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023024510
Kind Code:
A
Abstract:
To provide a resin composition having good tackiness that can produce an insulation layer capable of suppressing haloing phenomenon and excellent in peel strength, bulging during reflow and flame retardancy and to provide a resin sheet, a circuit board and a semiconductor chip package each using the resin composition.SOLUTION: The resin composition includes (A) an epoxy resin, (B) an elastomer, (C) magnesium hydroxide surface-treated with an alkoxysilane compound and (D) silica.SELECTED DRAWING: None

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JP2589664METHOD OF PREVENTING EPOXY-RESIN-CONTAINING COMPOSITION FROM CRYSTALIZING AND SOLIDIFYING
Inventors:
Hiroyuki Sakauchi
Hide Ikehira
Application Number:
JP2022194907A
Publication Date:
February 16, 2023
Filing Date:
December 06, 2022
Export Citation:
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Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08K3/36; C08K9/06; C08L101/00; H05K1/03
Domestic Patent References:
JP2006028274A2006-02-02
JP2013023666A2013-02-04
JP2010222391A2010-10-07
JP6852627B22021-03-31
Attorney, Agent or Firm:
Sakai International Patent Office



 
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