Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP7318586
Kind Code:
B2
Abstract:
The present invention relates to a resin composition which can provide a cured product having a low arithmetic average roughness (Ra) and a low specific dielectric constant (Dk) and dielectric loss tangent (Df). The resin composition includes: (A) a maleimide compound containing a divalent group represented by chemical formula (1) and a divalent group represented by chemical formula (2) and/or a divalent group represented by chemical formula (3) per molecule; (B) an epoxy resin; and (C) an inorganic filler, wherein the content of ingredient (C) is larger than 30 wt% based on 100 wt% of the non-volatile ingredients in the resin composition. In chemical formula (1)-chemical formula (3), the definition of each substituent is the same as defined in the specification.
Inventors:
Kenji Kawai
Application Number:
JP2020085487A
Publication Date:
August 01, 2023
Filing Date:
May 14, 2020
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L79/08; B32B27/34; B32B27/38; C08G73/10; C08G73/12; C08K3/013; C08L63/00; H05K1/03
Foreign References:
| WO2020158202A1 | ||||
| CN103965472A |
Attorney, Agent or Firm:
Sakai International Patent Office