Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP7443975
Kind Code:
B2
Abstract:
The present invention provides a resin composition and the like from which a cured product with low dielectric properties and excellent adhesion between copper foils can be obtained. The present invention comprises the resin composition comprising: (A) a polyether ether ketone compound with a maleimide group, and; (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group.
Inventors:
Kenji Kawai
Application Number:
JP2020128705A
Publication Date:
March 06, 2024
Filing Date:
July 29, 2020
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08F299/02; C08F2/44; C08G65/48; H05K1/03
Domestic Patent References:
| JP2020502310A | ||||
| JP62155255A |
Foreign References:
| WO2019244693A1 | ||||
| US7897715 |
Attorney, Agent or Firm:
Sakai International Patent Office
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