Title:
A resin molding apparatus and a resin molding method
Document Type and Number:
Japanese Patent JP6270532
Kind Code:
B2
Abstract:
The present invention relates to a resin molding apparatus and a resin molding method, capable of preventing precipitation of additives even if additives are added to liquid resin. A liquid resin storage mechanism is provided with a plurality of cylinders that store mixed liquid resin added with phosphors and a connecting portion connecting with each of the cylinders. A stirring mechanism is installed in at least one of the cylinders, the connecting portion, a storage portion and a static mixer provided in a dispenser to make the mixed liquid resin flow. A compressor is used to make the mixed liquid resin flow between the cylinders via the connecting portion, such that phosphors added in the mixed liquid resin flows with the mixed liquid resin, thereby preventing precipitation of the phosphors.
Inventors:
Tetsuya Yamada
Tomoyuki Goto
Junko Takada
Naomi Fujiwara
Yasuhiro Iwata
Tomoyuki Goto
Junko Takada
Naomi Fujiwara
Yasuhiro Iwata
Application Number:
JP2014032835A
Publication Date:
January 31, 2018
Filing Date:
February 24, 2014
Export Citation:
Assignee:
towa corporation
International Classes:
B29C31/04
Domestic Patent References:
| JP2012066386A | ||||
| JP2013176874A | ||||
| JP2006212550A | ||||
| JP54120582U | ||||
| JP2010137377A | ||||
| JP2008264707A | ||||
| JP4259528A | ||||
| JP2011167970A | ||||
| JP2015123738A | ||||
| JP2003170425A | ||||
| JP53139673A |
Foreign References:
| US4295439 |
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