Title:
A resin-molding object with a built-in RFIC package, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6135824
Kind Code:
B2
Abstract:
A resin molded body with an RFIC package incorporated therein is insert-molded incorporating therein a metal core material and an RFIC element connected to the metal core material. The RFIC element includes a ceramic multi-layer substrate that incorporates therein a coil conductor, and an RFIC chip mounted on a mounting surface of the multi-layer substrate. The RFIC chip is connected to the coil conductor by nano-particle bonding or ultrasonic bonding. The coil conductor is coupled with the core material in a magnetic field coupling scheme.
More Like This:
| JPH04272900 | IC CARD |
| JPH01218895 | PRODUCTION OF PORTABLE MEDIUM |
| JP2001066990 | PROTECTIVE FILTER AND PROTECTION METHOD OF IC TAG |
Inventors:
Tokiko Kato
Hiroyuki Imanishi
Hiroyuki Imanishi
Application Number:
JP2016525739A
Publication Date:
May 31, 2017
Filing Date:
April 23, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G06K19/077
Domestic Patent References:
| JP2000311226A | ||||
| JP2012137895A | ||||
| JP2008148345A | ||||
| JP2009157870A |
Foreign References:
| WO2014010346A1 |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Hiroshi Okabe
Mitsuo Tanaka
Hiroshi Okabe