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Title:
A resist composition, a resist pattern formation method, and a compound
Document Type and Number:
Japanese Patent JP6007011
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a compound useful for a resist composition, a resist composition containing the compound, and a method for forming a resist pattern by using the resist composition.SOLUTION: The resist composition comprises a base component (A) showing changes in the solubility with a developing solution by an action of an acid and a compound (D0) expressed by general formula (d0-1). The method for forming a resist pattern is carried out by using the composition. In the formula, Yrepresents a single bond or a divalent connecting group; Vrepresents a single bond or a divalent cyclic group optionally having a substituent; Rrepresents a monovalent group expressed by formula (r-d0) (where * represents a coupling bond); Rrepresents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms optionally having a substituent; n is 0 or 1, and when n is 0, Vis not a single bond; m is an integer of 1 or more; and Mrepresents an organic cation having a valence of m.

Inventors:
Akira Kawakami
Yoshiyuki Utsumi
Naoto Motoike
Application Number:
JP2012160049A
Publication Date:
October 12, 2016
Filing Date:
July 18, 2012
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/004; C07C25/18; C07C381/12; C07D307/33; C08F220/28; C09K3/00; G03F7/039
Domestic Patent References:
JP2011118123A
JP2012053336A
JP2013125146A
JP2012098390A
JP2013205837A
Foreign References:
WO2012053527A1
WO2012049919A1
US20120129104
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi