Title:
芳香族縮合環を含有する樹脂を含むリソグラフィー用レジスト下層膜形成組成物
Document Type and Number:
Japanese Patent JP5212666
Kind Code:
B2
Abstract:
Disclosed is a resist underlayer film-forming composition for lithography, which is effective during processing of a semiconductor substrate. Also disclosed are a resist pattern forming method using the resist underlayer film-forming composition, and a method for manufacturing a semiconductor device. The resist underlayer film-forming composition contains a polymer containing structural units represented by formula (1) and formula (2), a crosslinking agent and a solvent. When the total number of all structural units constituting the polymer is taken as 1.0, the ratio of the number (a) of the structural units represented by formula (1) and the ratio of the number (b) of the structural units represented by formula (2) are respectively within the following ranges: 0.3 = a = 0.95 and 0.05 = b = 0.7. The composition contains 3-30% by mass of the crosslinking agent relative to the solid content which is obtained by excluding the solvent from the composition.
Inventors:
Tokumasa Fujitani
Tetsuya Shinshiro
Tetsuya Shinshiro
Application Number:
JP2010508248A
Publication Date:
June 19, 2013
Filing Date:
April 16, 2009
Export Citation:
Assignee:
Nissan Chemical Industry Co., Ltd.
International Classes:
G03F7/11; C08F212/02; C08F226/12; C08F232/08; G03F7/40; H01L21/027
Domestic Patent References:
| JP2005250434A | 2005-09-15 | |||
| JP2005015532A | 2005-01-20 |
Foreign References:
| WO2005013601A1 | 2005-02-10 |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama
Miyazaki Yoshio
Tsutomu Kato
Kyoko Oyama