Title:
レジスト剥離剤組成物およびそれを用いた半導体素子の製造方法。
Document Type and Number:
Japanese Patent JP4320865
Kind Code:
B2
Inventors:
Ikemoto alone
Kojiro Abe
Maruyama Taketo
Aoyama Tetsuo
Kojiro Abe
Maruyama Taketo
Aoyama Tetsuo
Application Number:
JP27281199A
Publication Date:
August 26, 2009
Filing Date:
September 27, 1999
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
H01L21/027; H01L21/306; G03F7/42
Domestic Patent References:
| JP6250403A | ||||
| JP7219241A | ||||
| JP8137113A | ||||
| JP8305037A | ||||
| JP11084686A | ||||
| JP2000284506A |