Title:
A rivet type point of contact and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6051298
Kind Code:
B2
Abstract:
The present invention is a rivet contact including a head portion and a foot portion having a smaller width than the head portion, wherein the head portion contains a contact material layer having at least a top containing an Ag-based contact material; the rest of the head portion and the foot portion contain a base material containing Cu or a Cu alloy; and a barrier layer including an Ag alloy is provided at a junction interface between the contact material and the base material. Here, an Ag alloy obtained in such a manner that one or more base metal elements of Sn, In, Cu, Ni, Fe, Co, W, Mo, Zn, Cd, Te, and Bi are added to Ag by 0.03 to 20 mass % is preferably used as the Ag alloy constituting the barrier layer.
Inventors:
Kuroda Masao
Hiroshi Shirahata
Hiroshi Shirahata
Application Number:
JP2015514743A
Publication Date:
December 27, 2016
Filing Date:
December 13, 2013
Export Citation:
Assignee:
Tanaka Kikinzoku Kogyo Co., Ltd.
International Classes:
H01H1/04; H01H1/023; H01H1/0237; H01H1/025; H01H11/04
Domestic Patent References:
| JP2008270192A | 2008-11-06 | |||
| JPH0343916A | 1991-02-25 | |||
| JPH05282957A | 1993-10-29 | |||
| JP3098834B2 | 2000-10-16 |
Attorney, Agent or Firm:
Patent business corporation Tanaka, Okazaki and Associates