Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPH0641740
Kind Code:
A
Abstract:
PURPOSE: To provide the sputtering device which executes erosion uniform over the entire surface within a target surface in order to uniformalize a film thickness distribution and the film compsn. of thin films at the time of forming the thin films by sputtering.
CONSTITUTION: The target 6 is provided with an electromagnet 13 housed in a magnet holder 9 over the entire surface thereof and the inversion of the direction of magnetic fields is repeated by a power source 15 for controlling the electromagnet connected via a current introducing terminal 14, by which the drift motion of charge particles is controlled and the plasma uniform in space and time is formed. The target is thus eroded uniformly over the entire surface thereof.
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Inventors:
AOKURA ISAMU
YAMANISHI HITOSHI
OKAMOTO TADASHI
YAMANISHI HITOSHI
OKAMOTO TADASHI
Application Number:
JP20077192A
Publication Date:
February 15, 1994
Filing Date:
July 28, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C14/35; C23C14/54; (IPC1-7): C23C14/35; C23C14/54
Attorney, Agent or Firm:
Akira Kobiji (2 outside)