Sealing material, equipment housing, electronic equipment, sealing method

Title:

Sealing material, equipment housing, electronic equipment, sealing method

Document Type and Number:

Japanese Patent JP6300294

Kind Code:

B2

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Inventors:

Ohki Makoto
Hiroyuki Susaki
Makoto Sagae

Application Number:

JP2012218475A

Publication Date:

March 28, 2018

Filing Date:

September 28, 2012

Export Citation:

Assignee:

NEC Embedded Products Co., Ltd.

International Classes:

A63F7/02; A63F5/04; F16B41/00

Domestic Patent References:

Attorney, Agent or Firm:

Sumio Tanai
Ryuichiro Mori
Naoki Matsuo

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