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Title:
The sealing material for LED
Document Type and Number:
Japanese Patent JP6057582
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sealing material for an LED, which secures light transmittance in the short-wavelength ultraviolet region, also has durability to heat generation by an LED device and ultraviolet rays itself, and has economical efficiency.SOLUTION: The sealing material comprises an organic inorganic hybrid composition (X) containing a dimethylpolysiloxane (A) having a hydroxy terminal, an aluminum alkoxide (B), and a silicon alkoxide (C), and produced through dehydration condensation reaction, wherein the ratio of the number of the hydroxy group of the dimethylpolysiloxane having a hydroxy terminal and the number of the alkoxy group of the aluminum alkoxide in the organic inorganic hybrid composition is 1:0.1 to 1:1.5, and the ratio of the number of the hydroxy group of the dimethylpolysiloxane having a hydroxy terminal and the number of the alkoxy group of the silicon alkoxide in the organic inorganic hybrid composition is 1:2 to 1:50. The material 1 is coated on a substrate by dropping the material on the substrate having the LED 2 mounted thereon.

Inventors:
Miki Yoshida
Tetsuya Suzuki
Kiyo Sayo
Application Number:
JP2012160605A
Publication Date:
January 11, 2017
Filing Date:
July 19, 2012
Export Citation:
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Assignee:
Ishizuka Glass Co., Ltd.
International Classes:
C08G77/58; C08G79/10; H01L23/29; H01L23/31
Domestic Patent References:
JP2008274272A
JP2011219729A
JP2064131A
JP2009127021A
JP10095852A
JP60076536A
JP11246661A
JP2000026610A
JP46030594B1
Foreign References:
WO2010055628A1
Attorney, Agent or Firm:
Noriaki Goto