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Title:
LAMINATED MOLDING
Document Type and Number:
Japanese Patent JPH0687185
Kind Code:
A
Abstract:

PURPOSE: To obtain a laminated molding, light in weight and large in shock- absorbing capacity, by a method wherein a part causing slip deformation by an external force is provided on a lamination plane on the occasion of lamination molding of reinforcing fibers impregnated with thermoplastic resin.

CONSTITUTION: Resin sheets each of which contains reinforcing fibers impregnated with thermoplastic resin and making up 20vol.% and is made to be 0.1 to 1mm thick are molded in lamination. At this time, a part causing slip deformation by an external force is provided on a lamination plane. It is preferable that an interlayer adhesion of the part causing this slip deformation is designed to be 80 or more when the interlayer adhesion of another lamination plane not causing the slip deformation is made 100. One of the means for this purpose is to provide a nonadhesive part on the lamination plane by disposing a film or the like. It is preferable, besides, that the area on the lamination plane of the non-adhesive part in a part W of a molded body to be subjected to a shock is made to be 5 to 60% when the area on the lamination plane of the part W is made 100%. The lamination plane of the part W to be subjected to shock is formed preferably with a lamination angle having a curvature of a radius 5 to 20mm.


Inventors:
KISHI SATOSHI
NAKAKURA TOSHIYUKI
TANABE HIROSHI
SAKAI HIDEO
Application Number:
JP17043393A
Publication Date:
March 29, 1994
Filing Date:
July 09, 1993
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
B32B5/28; B32B7/02; B32B7/04; B32B27/32; F16F7/00; (IPC1-7): B32B7/04; B32B5/28; B32B7/02; B32B27/32; F16F7/00