SEMICONDUCTOR CHIP TESTING DEVICE AND SEMICONDUCTOR CHIP TESTING METHOD

Japanese Patent JP2017040561

A

PROBLEM TO BE SOLVED: To provide a technique capable of preventing generation of electrical discharge at a time of measuring electrical characteristics of a test object.SOLUTION: The semiconductor chip testing device is provided with: a lower fixture 8; a contact pin 1; an upper fixture 7 which is disposed above a semiconductor chip 6, which is the test object, and to which the contact pin 1 is secured; an insulation wall 3 that is disposed at a position surrounding side surfaces of the semiconductor chip 6 and is capable of sealing the semiconductor chip 6 cooperatively with the upper fixture 7 and the lower fixture 8; gas injection ports 2 disposed in the upper fixture 7 so as to be capable of injecting an insulation gas toward the surfaces of the semiconductor chip 6; and a gas supply part 12 that supplies the insulation gas to the gas injection ports 2. The gas supply part 12 is configured to supply the insulation gas to the gas injection ports 2 at a preset cycle when the semiconductor chip 6 is placed on the lower fixture 8 without being sealed.SELECTED DRAWING: Figure 1

TAKAGI YASUSHI

JP2015162476A

February 23, 2017

August 20, 2015

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MITSUBISHI ELECTRIC CORP

G01R31/26; G01R31/28; H01L21/66

JP2015035577A	2015-02-19
JP2013030647A	2013-02-07
JP2012189674A	2012-10-04
JP2015053416A	2015-03-19
JP2007050352A	2007-03-01
JPH11238770A	1999-08-31
JP2000164648A	2000-06-16
JP2013258386A	2013-12-26
JPH02106050A	1990-04-18
JPH0637121A	1994-02-10
JP2014145615A	2014-08-14

US20130043875A1	2013-02-21
WO2012026036A1	2012-03-01

Yoshitake Hidetoshi
Takahiro Arita

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