Title:
A semiconductor device and electronic equipment
Document Type and Number:
Japanese Patent JP6041961
Kind Code:
B2
Abstract:
It is an object of the present invention to manufacture, with high yield, semiconductor devices in each of which an element which has a layer containing an organic compound is provided over a flexible substrate. A method for manufacturing a semiconductor device includes: forming a separation layer over a substrate; forming an element-forming layer by forming an inorganic compound layer, a first conductive layer, and a layer containing an organic compound over the separation layer, and forming a second conductive layer which is in contact with the layer containing an organic compound and the inorganic compound layer; and after attaching a first flexible substrate over the second conductive layer, separating the separation layer and the element-forming layer at the separation layer.
Inventors:
Suzuki Tsunetori
Ryoji Nomura
Yukawa Mikio
Nobuharu Osawa
Keika Moriwaka
Yoshinobu Asami
Takehisa Sato
Ryoji Nomura
Yukawa Mikio
Nobuharu Osawa
Keika Moriwaka
Yoshinobu Asami
Takehisa Sato
Application Number:
JP2015207068A
Publication Date:
December 14, 2016
Filing Date:
October 21, 2015
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L29/786; G09F9/30; H01L21/336; H01L21/8238; H01L27/08; H01L27/092; H01L27/10; H01L27/105; H01L27/28; H01L27/32; H01L51/05; H01L51/50; H05B44/00
Domestic Patent References:
| JP2004282063A | ||||
| JP2002318556A | ||||
| JP2004139970A | ||||
| JP2004207217A |
Previous Patent: A cardiovascular functional disorder, gene polymorphism relevant to a medicine response, those detec...
Next Patent: JPS6041962
Next Patent: JPS6041962