Title:
半導体装置および半導体装置モジュール
Document Type and Number:
Japanese Patent JP4350295
Kind Code:
B2
Inventors:
Hiroshi Nakatake
Toshiyuki Kikunaga
Akihiko Iwata
Hiroshi Ito
Giichi Tsunoda
Toshiyuki Kikunaga
Akihiko Iwata
Hiroshi Ito
Giichi Tsunoda
Application Number:
JP2000326886A
Publication Date:
October 21, 2009
Filing Date:
October 26, 2000
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L27/04; H03K17/08; H01L29/78; H02H7/20; H02H9/04; H02M1/00; H02M7/48; H03K17/56; H03K19/003
Domestic Patent References:
| JP10248237A | ||||
| JP2050518A | ||||
| JP3183209A | ||||
| JP6120788A | ||||
| JP2037828A | ||||
| JP10000250U |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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