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Patent Searching and Data


Title:
樹脂組成物及び樹脂組成物を使用して作製した半導体装置
Document Type and Number:
Japanese Patent JPWO2012033135
Kind Code:
A
Inventors:
Takashi Kawana
Naoya Kanamori
Murayama Ryuichi
Application Number:
JP2011070397W
Publication Date:
January 20, 2014
Filing Date:
September 07, 2011
Export Citation:
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Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08F218/16; C08F290/06; C08F222/40; C08K3/00; C08L35/00
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga