Title:
A semiconductor device provided with the resin composition for semiconductor closure, and its hardened material
Document Type and Number:
Japanese Patent JP5943486
Kind Code:
B2
Inventors:
Shoichi Nagata
Kenji Hagiwara
Yokota Ryuhei
Kenji Hagiwara
Yokota Ryuhei
Application Number:
JP2013178272A
Publication Date:
July 05, 2016
Filing Date:
August 29, 2013
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/20; C08G59/40; C08K3/00; C08K5/13; C08K5/315; H01L23/29; H01L23/31
Domestic Patent References:
| JP2011026419A | ||||
| JP2012131945A | ||||
| JP2013053218A |
Foreign References:
| WO2012053522A1 |
Attorney, Agent or Firm:
Mitsuo Matsui