A semiconductor device provided with the resin composition for semiconductor closure, and its hardened material

Title:

A semiconductor device provided with the resin composition for semiconductor closure, and its hardened material

Document Type and Number:

Japanese Patent JP5951569

Kind Code:

B2

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Inventors:

Shoichi Nagata
Kenji Hagiwara
Yokota Ryuhei

Application Number:

JP2013179580A

Publication Date:

July 13, 2016

Filing Date:

August 30, 2013

Export Citation:

Assignee:

Shin-Etsu Chemical Co., Ltd.

International Classes:

C08G18/32; C08K3/26; C08K5/548; C08L75/04; H01L23/29; H01L23/31

Domestic Patent References:

Foreign References:

WO2013047203A1
WO2012131971A1

Attorney, Agent or Firm:

Mitsuo Matsui

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