Title:
Semiconductor devices, solid-state image sensors, and camera systems
Document Type and Number:
Japanese Patent JP6332420
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device, solid state image sensor and camera system, capable of reducing interference between signals in which adjacent veers are transmitted, thereby suppressing the number of veers from increasing, reducing the area and packaging process of a chip having a sensor and thus achieving cost reduction.SOLUTION: The present invention increases a first chip 110 and a second chip 120 and the first chip 110 and the second chip 120 are bonded to each other to form a laminated structure. The first chip and the second chip are wired through a veer 114. The first chip 110 includes a function of transmitting a time-discrete signal of an analog signal generated at each sensor 111 to the second chip through a corresponding veer and the second chip 120 includes a function of sampling a signal transmitted from the first chip through the veer at different timing from the timing that a signal is sampled with the first chip and a function of acquiring a digital signal by quantification.SELECTED DRAWING: Figure 10
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Inventors:
Toshiaki Nagai
Satoshi Ozeki
Ueno Yousuke
Atsushi Suzuki
Satoshi Ozeki
Ueno Yousuke
Atsushi Suzuki
Application Number:
JP2016235760A
Publication Date:
May 30, 2018
Filing Date:
December 05, 2016
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H04N5/3745; H01L27/146; H03K5/08; H03M1/08; H03M1/56; H04N5/378
Domestic Patent References:
| JP2009170448A | ||||
| JP2011129784A | ||||
| JP2010165854A |
Foreign References:
| WO2006129762A1 |
Attorney, Agent or Firm:
Yasuhiro Iijima