Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023176880
Kind Code:
A
Abstract:
To provide a technology in which manufacturability of a semiconductor device can be improved by shortening wiring length of a wire.SOLUTION: A semiconductor device 100 comprises: a semiconductor element 1; a control IC 2 that controls the semiconductor element 1. The semiconductor element 1 comprises a pair of signal pad groups 11a and 11b that are composed of a plurality of signal pads 10a, 10b, 10c, and 10d, the control IC 2 comprises a plurality of signal pads, and the plurality of signal pads in the control IC 2 are connected by wire bonding to the signal pad groups 11a and 11b having a nearer distance to the plurality of signal pads in the control IC 2, of the pair of signal pad groups 11a and 11b in the semiconductor element 1.SELECTED DRAWING: Figure 1
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Inventors:
KAWAMOTO KEISUKE
EGUCHI KEISUKE
EGUCHI KEISUKE
Application Number:
JP2022089429A
Publication Date:
December 13, 2023
Filing Date:
June 01, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/07; H01L21/60
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita
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