Title:
半導体装置
Document Type and Number:
Japanese Patent JP7156172
Kind Code:
B2
Abstract:
To disclose a technology for taking countermeasures for an excess bonding material.SOLUTION: A semiconductor device according to the present disclosure comprises: a semiconductor element; a first conductor plate that is bonded to the semiconductor element through a first bonding material; and a second conductor plate that is bonded to the semiconductor element through a second bonding material. According to an aspect of the present disclosure, a surface of the first conductor plate has a first region that contacts with the first bonding material, and a second region that surrounds the first region and that has lower affinity to the first bonding material than the first region. In a plan view, a boundary between the first region and the second region surrounds a circumference of the semiconductor element, and a space between the circumference of the semiconductor element and the boundary is partially expanded along the circumference of the semiconductor element.SELECTED DRAWING: Figure 2
Inventors:
Takanori Kawashima
Atsuko Yamanaka
Atsuko Yamanaka
Application Number:
JP2019097019A
Publication Date:
October 19, 2022
Filing Date:
May 23, 2019
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L25/07; H01L23/48; H01L25/18
Domestic Patent References:
| JP3008242U | ||||
| JP2007103909A | ||||
| JP2008207207A | ||||
| JP2012084686A |
Attorney, Agent or Firm:
Patent Attorney Corporation Kaiyu International Patent Office