Title:
半導体装置
Document Type and Number:
Japanese Patent JP7158199
Kind Code:
B2
Abstract:
To provide a small-sized semiconductor device which incorporates two identical semiconductor chips, is capable of arranging sensor elements formed on the semiconductor chips in close proximity with high precision and has excellent functional safety.SOLUTION: A semiconductor device 100 includes a lead having an upper surface and a lower surface, and a tapered portion 133 having a taper in a direction from one end to the other end in a cross-sectional view, which is provided at the other end, a first semiconductor chip 110 having a first electrode 112 formed on its surface, a second semiconductor chip 120 having a second electrode 122 formed on its surface, and a sealing body made of an epoxy resin 140, and the first electrode 112 is electrically connected to the upper surface of the tapered portion 133, and the second electrode 122 is electrically connected to the lower surface of the tapered portion 133.SELECTED DRAWING: Figure 1
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Inventors:
Takahiro Kato
Seimei Kadoi
Seimei Kadoi
Application Number:
JP2018143952A
Publication Date:
October 21, 2022
Filing Date:
July 31, 2018
Export Citation:
Assignee:
Abric Co., Ltd.
International Classes:
H01L25/065; H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| JP4061152A | ||||
| JP2004296624A | ||||
| JP5029520A | ||||
| JP4199697A | ||||
| JP2003188204A | ||||
| JP11345842A | ||||
| JP4329659A | ||||
| JP2017135335A | ||||
| JP10275827A |
Foreign References:
| WO2016129288A1 |
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