Title:
半導体装置
Document Type and Number:
Japanese Patent JP7160105
Kind Code:
B2
Abstract:
A semiconductor device includes a first semiconductor chip, and a second semiconductor chip, wherein the first semiconductor chip includes a substrate including a first principal surface facing the second semiconductor chip and a second principal surface opposite to the first principal surface, a first power supply line and a second power supply line arranged on the second principal surface of the substrate, a power supply switch circuit arranged electrically between the first power supply line and the second power supply line, a first via arranged in the substrate to extend from the first power supply line to the first principal surface, and a second via arranged in the substrate to extend from the second power supply line to the first principal surface, wherein the second semiconductor chip includes a third power supply line connected to the first via, and a fourth power supply line connected to the second via.
Inventors:
Hironori Takeno
Wan Wenzen
Atsushi Okamoto
Wan Wenzen
Atsushi Okamoto
Application Number:
JP2020547793A
Publication Date:
October 25, 2022
Filing Date:
September 28, 2018
Export Citation:
Assignee:
Socionext Inc.
International Classes:
H01L21/822; H01L21/3205; H01L21/768; H01L21/82; H01L21/8234; H01L23/522; H01L27/00; H01L27/04; H01L27/088
Domestic Patent References:
| JP2010118590A | ||||
| JP2016035966A | ||||
| JP2017028085A | ||||
| JP2008251835A | ||||
| JP2010225782A | ||||
| JP2016025103A | ||||
| JP2005032839A | ||||
| JP2017037920A |
Foreign References:
| WO2007099841A1 | ||||
| US20120249222 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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