Title:
半導体装置
Document Type and Number:
Japanese Patent JP7275505
Kind Code:
B2
Abstract:
To solve the following problem: A semiconductor module of a semiconductor device, when miniaturized, has a tendency of generating a slender shape by necessity of an insulation distance between terminals and has low cooling performance insufficient for the semiconductor module by a radiator.SOLUTION: The semiconductor device includes: a radiator; a semiconductor module which has heat dissipation metal on a rear face thereof and whose rear face side is fixed in contact with radiator by screws at the two or more positions in the lengthwise direction; and a fixture pressing the semiconductor module toward the radiator between the two screws in the lengthwise direction of the semiconductor module.SELECTED DRAWING: Figure 1
Inventors:
Shonao Saga
Application Number:
JP2018167171A
Publication Date:
May 18, 2023
Filing Date:
September 06, 2018
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/40
Domestic Patent References:
| JP2004253531A | ||||
| JP2011009370A |
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office