Title:
半導体レーザ装置
Document Type and Number:
Japanese Patent JP7365353
Kind Code:
B2
Abstract:
A semiconductor laser device includes a semiconductor laser chip that emits laser light, a plate-like base, and a block protruding from the base and supporting the semiconductor laser chip. The block has a supporting surface and a wire bonding surface. The supporting surface faces a first side in a first direction perpendicular to the laser light emitting direction, and supports the semiconductor laser chip. The wire bonding surface is a surface to which a wire connected to the semiconductor laser chip is connected. The wire bonding surface is shifted in a second direction perpendicular to the emitting direction and the first direction with respect to the supporting surface. The wire bonding surface is inclined relative to the supporting surface, such that the wire bonding surface is more offset to a second side in the first direction with increasing distance from the supporting surface in the second direction.
Inventors:
Kenji Sakai
Kazutaka Izumi
Kazutaka Izumi
Application Number:
JP2020548582A
Publication Date:
October 19, 2023
Filing Date:
September 19, 2019
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01S5/02345; H01S5/022; H01S5/02212
Domestic Patent References:
| JP201422379A | ||||
| JP10256643A | ||||
| JP2013258434A | ||||
| JP201166327A | ||||
| JP201449523A |
Foreign References:
| US20100008093 |
Attorney, Agent or Firm:
Hisashi Usui
Shintaro Suzuki
Shintaro Suzuki