Title:
半導体発光装置
Document Type and Number:
Japanese Patent JP7337590
Kind Code:
B2
Abstract:
There is provided a semiconductor light-emitting device including: a main lead including a main surface; a semiconductor light-emitting element mounted on the main surface of the main lead; a bonding material that bonds the semiconductor light-emitting element to the main surface of the main lead; a sub lead arranged in a first direction with respect to the main lead and including a main surface facing the same side as the main surface of the main lead; a first wire including a first end connected to the main surface of the sub lead and a second end connected to the semiconductor light-emitting element; a resin case including a case main surface facing the same direction as the main surfaces of the main lead and the sub lead and supporting the main lead and the sub lead.
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Inventors:
宮▲崎▼ 大
Masahiko Kobayakawa
Masahiko Kobayakawa
Application Number:
JP2019143493A
Publication Date:
September 04, 2023
Filing Date:
August 05, 2019
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L33/62
Domestic Patent References:
| JP2017076793A | ||||
| JP2010129985A | ||||
| JP2018520500A | ||||
| JP2016184708A | ||||
| JP2012216654A | ||||
| JP2012079723A | ||||
| JP2011249807A | ||||
| JP2011134825A | ||||
| JP2011097011A | ||||
| JP2009009956A | ||||
| JP2008251937A | ||||
| JP2007311749A | ||||
| JP2006516816A | ||||
| JP2006514434A | ||||
| JP10294495A | ||||
| JP62047156U |
Foreign References:
| WO2018233839A1 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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